cys tech electronics corp. s pec. no. : c335 c2 issued date : 20 13.02.05 revised date : page no. : 1/6 BAS21C2 c y s t ek product s pecification high voltage switching diode BAS21C2 description high voltage switching diode encapsulated in a sod-523 small plastic smd package. features ? fast switching speed ? low forward voltage drop ? small plastic smd package ? pb-free lead plating package mechanical data ? case: molded plastic, jedec sod-523. ? terminals: solder plated, solderable per mil-std-750 method 2026 ? polarity: indicated by cathode band. ? mounting position : any. symbol outline http://
cys tech electronics corp. s pec. no. : c335 c2 issued date : 20 13.02.05 revised date : page no. : 2/6 BAS21C2 c y s t ek product s pecification absolute maximum ratings (t a =25 , unless otherwise noted) parameters conditions symbol min typ max units repetitive peak reverse voltage v rrm 300 v rms voltage v rms 210 v continuous reverse voltage v r 300 v continuous forward current i f 250 ma repetitive peak forward current tp=1ms, duty 0.25 i frm 1 a non-repetitive peak forward current t=1 s i fsm 4.5 a t a =25c (n ote 1) 250 total device dissipation t sp 90 c ( n ote 2) p d 500 mw junction to ambient (note 1) r t ja 500 thermal resistance junction to soldering point (note3) r jsp 120 q c/w storage temperature range tstg -65 150 q c operating junction temperature range tj -55 150 q c note :1.parts mounted on fr-5 board with minimum pad, in free air. 2 . t s p is the s o lder point tem p eratur e at th e s o lder ing poin t of th e cathod e t a b. 3 . soldering point of cathode tab. characteristics (ta=25 q c) characteristic symbol condition min. max. unit reverse breakdown voltage v br i r =100 a 300 - v v f (1) i f =100ma - 1 v forward v o ltage (note) v f (2) i f =200ma - 1.25 v i r (1) v r =250v,tj=25 - 150 na reverse leakage current (note) i r (2) v r =250v,tj=150 100 a diode capacitance c d v r =0v, f=1mhz - 5 pf reverse recovery time t rr i f =i r =30ma rl=100 : measured at i r =3ma - 50 ns notes : pulse test, tp=300 s, duty cycle<2%. ordering information device package shipping BAS21C2-0-t5-g sod-523 (pb-free lead plating an d halogen-free package) 8000 pcs / tape & reel
cys tech electronics corp. s pec. no. : c335 c2 issued date : 20 13.02.05 revised date : page no. : 3/6 BAS21C2 c y s t ek product s pecification typical characteristics f o r w a r d c u rre n t v s f o rw a r d v o l t a g e 0.1 1 10 10 0 100 0 0 0 . 3 0 . 6 0 .9 1 .2 1 .5 f o rw a r d v o l t a g e ---v f (v ) i n s t a n t a n e o u s f orw a rd c u r re nt -- -if (ma ) pulse width=300s 25c 75c 100c 125c 150c r e v e r s e l ea k a g e c u r r e n t v s r e v e r s e v o lt ag e 0.001 0. 01 0. 1 1 10 10 0 0 50 100 150 20 0 250 r e v e rs e v o l t a g e ---v r (v ) r e v e r s e le ak ag e c u r r e n t - - - i r ( a ) 100 75 25 125 150c j unc t i on ca pa c i t a n c e vs r e ve r s e v ol t a ge 0.1 1 10 0 . 1 1 10 10 0 r e ve rs e v o l t a ge -- -v r (v ) j u nc t i on c a pa c i t a nc e - - - c j (p f ) tj=25, f=1.0mhz p o w e r d e r a t i n g c u rv e 0 50 100 150 200 250 300 0 2 5 50 75 1 00 12 5 15 0 175 t a , a m b i e n t te m p er at u r e ( ) p d , p o we r dis s i p a tio n ( m w ) recommended footprint
cys tech electronics corp. s pec. no. : c335 c2 issued date : 20 13.02.05 revised date : page no. : 4/6 BAS21C2 c y s t ek product s pecification reel dimension carrier tape dimension
cys tech electronics corp. s pec. no. : c335 c2 issued date : 20 13.02.05 revised date : page no. : 5/6 BAS21C2 c y s t ek product s pecification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cys tech electronics corp. s pec. no. : c335 c2 issued date : 20 13.02.05 revised date : page no. : 6/6 BAS21C2 c y s t ek product s pecification sod-523 dimension 1 2 style : pin 1. cathode 2. anode 2-lead sod-523 plastic package cystek packa g e code : c2 marking code : 1 2 js *: typical millimeters inches millimeters inches dim min. max. min. max. dim min. min. max. min. max. a 0.510 0.770 0.020 0.031 e 1.100 1.300 0.043 0.051 a1 0.500 0.700 0.020 0.028 e1 1.500 1.700 0.059 0.067 b 0.250 0.350 0.010 0.014 e2 0.200 ref 0.008 ref c 0.080 0.150 0.003 0.006 l 0.010 0.070 0.001 0.003 d 0.750 0.850 0.030 0.033 7 ref 7 ref notes: 1.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 2.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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